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RTSP1200-DPC Copper/Silver/gold/ graphite ultra thin filme depostion machine

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SHANGHAI ROYAL TECHNOLOGY INC.
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RTSP1200-DPC Copper/Silver/gold/ graphite ultra thin filme depostion machine

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Brand Name :ROYAL
Model Number :RTSP1200-DPC
Certification :CE certification
Place of Origin :Made in China
MOQ :1 set
Price :negotiable
Payment Terms :L/C, D/A, D/P, T/T
Supply Ability :6 sets per month
Delivery Time :12 weeks
Packaging Details :Export standard, to be packed in new cases/cartons, suitable for long-distance ocean/air and inland transportation.
Deposition Sources :Magnetron DC / MF Sputtering + Steered Cathodic Arc
Deposition Films :Ni, Cu, Ag, Au, Ti, Zr, Cr etc.
Applications :LED Ceramic Chips with Cooper Plating, Al2O3, AlN ceramic circuit boards, Al2O3 plates on LED, semiconductor
Film Features :wear resistance, strong adhesion, decorative coating colors
Factory Location :Shanghai city, China
Worldwide Service :Poland - Europe; Iran- West Asia & Middle East, Turkey, India, Mexico- South America
Training Service :Machine operation, maintenance, coating process Recipes, program
Warranty :Limited warranty 1 year for free, whole life for machine
OEM & ODM :available, we support tailor made design and fabrication
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DC pure metal magnetron sputtering deposition machine, Copper/Silver/gold/ graphite ultra thin filme depostion machine

Performance

1. Ultimate Vacuum Pressure: better than 5.0×10-6 Torr.

2. Operating Vacuum Pressure: 1.0×10-4 Torr.

3. Pumpingdown Time: from 1 atm to 1.0×10-4 Torr≤ 3 minutes ( room temperature, dry, clean and empty chamber)

4. Metalizing material (sputtering + Arc evaporation): Ni, Cu, Ag, Au, Ti, Zr, Cr etc.

5. Operating Model: Full Automatically /Semi-Auto/ Manually

Structure

The vacuum coating machine contains key completed system listed below:

1. Vacuum Chamber

2. Rouhging Vacuum Pumping System (Backing Pump Package)

3. High Vacuum Pumping System ( Magnetically Suspension Molecular Pump)

4. Electrical Control and Operation System

5. Auxiliarry Facility System (Sub System)

6. Deposition System

Copper Sputtering Coating Machine Key Features

1. Equipped with 8 steer arc cathodes and DC Sputtering Cathodes, MF Sputtering Cathodes, Ion source unit.

2. Multilayer and co-deposition coating available

3. Ion source for plasma cleaning pre-treatment and Ion-beam assisted deposition to enhance the film adhesion.

4. Ceramic/ Al2O3/AlN substrates heating up unit;

5. Substrate rotation and revolution system, for 1-side coating and 2-sides coating.

RTSP1200-DPC  Copper/Silver/gold/ graphite ultra thin filme depostion machine

Cooper Magnetron Sputtering Coating Plant on Ceramic Radiating Substrate

The DPC process- Direct Plating Copper is an advanced coating technology applied with LED / semiconductor / electronic industries. One typical application is Ceramic Radiating Substrate.

Cooper conductive film deposition on Al2O3, AlN substrates by PVD vacuum sputtering technology, compared with traditional manufacturing methods: DBC LTCC HTCC, much lower production cost is its high feature.

Royal technology team assited our customer to developed the DPC process sucessfully with PVD sputtering technology.

The RTAC1215-SP machine designed exclusively for Copper conductive film coating on Ceramic chips, ceramic circuit board.

RTSP1200-DPC  Copper/Silver/gold/ graphite ultra thin filme depostion machine

Please contact us for more specifications, Royal Technology is honored to provide you total coating solutions.

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